An announcement from the National Electronics Manufacturing Initiative (NEMI), IPC (Association Connecting Electronics Industries), and RosettaNet describes the release of three key product data exchange standards for the computer electronics industry. The three XML-based standards [IPC-2571, IPC-2576 and IPC-2578] describe how PDX will work with other related standards and formats; they facilitate quote, manufacture, configure, test and kit interactions among supply chain partners; and they define how the build history of boards and final assembly are exchanged. These specifications will, for example, enable trading partners to automatically load bill of materials (BOM) information, update and track approvals of engineering change orders (ECOs) and encode approved vendors lists (AVLs) and approved manufacturers lists (AMLs). A fourth PDX standard currently in the IPC review process [IPC-2577] defines an XML encoding scheme that captures the setting and updating of quality goals, communicating and responding to quality excursions and reporting actual data from manufacturing and repair operations. Information represented in this standard includes such things as manufacturing site, manufacturing date, part number, serial number, manufacturing quality results and failure tracking data."
From the announcement:
The three Product Data eXchange (PDX) standards were developed by NEMI's Virtual Factory Information Interchange Project (VFIIP). These specifications provide standard interfaces for exchanging data within the manufacturing supply web so that companies can increase efficiencies, shorten time to market and improve return on investment (ROI).
IPC created the 2570 series specifically for standards resulting from NEMI's Virtual Factory Project. RosettaNet, an industry consortium focused on development of open e-business process interfaces, worked with NEMI and IPC to integrate the PDX standards into its own Cluster 2 and Cluster 7 Partner Interface Processes (PIPs). These PIPs relate to distribution and update of production information and to the exchange of technical data for manufacturing. The three organizations coordinated closely to ensure consistency of naming conventions and structure between the IPC standards and RosettaNet's dictionaries and specifications. Several Cluster 2 Product Information PIPs (2C1-2C6) have already been ratified. These interfaces enable distribution and periodic update of product and detailed design information, including product change notices and product technical specifications. Additional Cluster 2 PIPs have recently gone to RosettaNet members for vote (2C7-2C10).
The National Electronics Manufacturing Initiative's mission is to facilitate leadership of the North American electronics manufacturing supply chain. Based in Herndon, Va., the industry-led consortium is made up of more than 60 electronics equipment manufacturers, suppliers, industry associations and consortia, government agencies and universities. NEMI roadmaps the needs of the North American electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies.
IPC (Association Connecting Electronics Industries) is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,700 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of a $44 billion US industry employing more than 400,000 people.
IPC-2571. "Generic Requirements for Supply Chain Communication of Product Data Exchange." 43 pages. November 2001. This standard "defines an XML encoding scheme that enables a total product definition to be described at a level appropriate to facilitate supply chain interactions. The standard is designed to transfer technical information including bill of materials (BOM), approved manufacturer list (AML), as-built product configuration, and change (Engineering, Manufacturing, Product) information." [cache]
IPC-2576. "Sectional Requirements for Supply Chain Communication of As-Built Product Data." 14 pages. November 2001. This sectional standard "provides an XML encoding schema to allow electronics manufacturing supply chain partners to exchange as-built product configuration and manufacturing process information. The information represented by this standard may be used to continue to support products throughout their life cycles. The information represented in this standard includes: as-built product characteristics related to form, fit and function; serialization; batch/lot information; manufacturing site; manufacturing date; part number; component and sub-assembly data." [cache]
IPC-2578. "Sectional Requirements for Supply Chain Communication of Product Design Configuration Data." 34 pages. November 2001. This sectional standard "provides an XML encoding scheme to allow electronics manufacturing supply chain partners to exchange sufficient product data to enable distributed manufacturing. The information represented by this standard includes bills of material (BOM), approved manufacturer lists (AML), approved supplier lists (ASL), change history and engineering change orders, and a high-level description of the components listed on a bill of material." [cache]
IPC-2577. Draft. "Sectional Requirements for the Supply Chain (B2B) Communication of Quality Product Data." 50 pages. November 2001. This standard (IPC 2577) covers the sectional requirements for Product Quality, Quality manufacturing and Quality repair information including Failure Tracking. This standard defines an XML encoding scheme that captures the setting and updating of quality goals, communicating and responding to quality excursions and reporting actual data from manufacturing and repair operations. The IPC-2577 standard defines how manufacturing and repair product quality and information is exchanged between supply chain partners. Information represented in this standard includes such things as; manufacturing site, manufacturing date, part number, serial number, manufacturing quality results and failure tracking data." [cache]
- Announcement 2001-11-12: "IPC Publishes Final Specifications for Three Product Data Exchange (PDX) Standards. Standards are Result of Collaborative Effort between Key Industry Players, NEMI, IPC and RosettaNet."
- IPC 2571 Document Type Definition (DTD). 2001-11. Includes all elements from the IPC-2571, IPC-2576 and IPC-2578." [extracted from the PDF spec]
- NEMI Virtual Factory Information Interchange Project (VFIIP)
- IPC: Association Connecting Electronics Industries
- National Electronics Manufacturing Initiative (NEMI)
- PDX Standard Group web site
- "Product Definition Exchange (PDX) Standards" - Main reference page.